Reflow Tracker Systems

Description

The Datapaq® Reflow Tracker® temperature profiling system travels through the process, enabling you to monitor wave and reflow soldering, as well as vapor phase, selective soldering and rework stations. Comprised of specifically designed thermocouples, data loggers, protective thermal barriers and Insight software, this system will help you optimize product quality, expedite process set-up, increase yields and minimize the need for rework.

The Datapaq Reflow Tracker® System sets the industry standard for ease-of-use and reliability in thermal profiling. This rugged and reliable, yet lightweight system, is ideal for the following list of applications in electronics assembly and manufacturing:

  • Reflow
  • Wave Solder
  • Vapor Phase
  • Tack/Cure
  • Conformal Coating

Memory

55,000 readings per channel

Sampling Interval

0.05 seconds to 10 minutes

Accuracy

±0.5°C (±0.9°F)

Resolution

0.1°C (0.2°F)

Maximum Internal Operating Temperature

85°C (185°F)

Temperature Range

-200°C to 1370 °C (-328 °F to 2498 °F)

Data Collection Start

Start/ Stop buttons , time or temperature trigger

Battery

Nickel Metal Hydride (NiMH) rechargeable

Thermocouples

Type K, Special Limits of Error ANSI MC 96.1

 

Part Number

Height

Width

Length

Weight

No of Channels

DQ1812

20mm (0.8 in)

60mm (2.4 in)

237 mm (9.3 in)

0.4 kg (12.4 oz)

12

DQ1810

20mm (0.8 in)

60mm (2.4 in)

221 mm (8.7 in)

0.3 kg (10.5 oz)

10

DQ1860

11.7 mm (0.5 in)                       

106 mm (4.2 in)

150 mm (5.9 in)

0.4 kg (12.4 oz)

6

DQ1862

20 mm (0.8 in)

57 mm (2.2 in)

165 mm (6.4 in)

0.3 kg (10.5 oz)

6

DQ1861

12mm (0.5 in)

62 mm (2.4 in)

302 mm (12 in)

0.4 kg (12.4 oz)

6

 Standard System Thermal Barriers

Part

Height

Width

Length

Weight

Time @ Temperature(min)

@200°C           @250°C             @280°C

(392 °F)            (482°F)              (536°F)

DQ1812 Suitable Thermal Barriers

TB2081

28 mm (1.1 in)

88 mm (3.4 in)

274 mm (10.17 in)

0.6 kg (1.3 lbs)

10                          8                            7

TB2082

35 mm (1.3 in)

88 mm (3.4 in)

274 mm (10.17 in)

0.7 kg (1.5 lbs)

13                         11                           10

DQ1810 suitable Thermal Barriers

TB2061

28 mm (1.1 in)

88 mm (3.4 in)

258 mm (10.1 in)

0.6 kg (1.3 lbs)

10                         8                               7

TB2062

35 mm (1.3 in)

88 mm (3.4 in)

258 mm (10.1 in)

0.7 kg (1.5 lbs)

13                         11                           10

DQ1860 Suitable Thermal Barriers

TB2064

20 mm (.79 in)

133 mm (5.2 in)

210 mm (8.2 in)

0.6 kg (1.3 lbs)

9                             8                            6

TB2015

25 mm (.98 in)

133 mm (5.2 in)

210 mm (8.2 in)

0.6 kg (1.3 lbs)

13                         10                            9

TB2065

29 mm (1.1 in)

133 mm (5.2 in)

210 mm (8.2 in)

0.6 kg (1.3 lbs)

13                         11                           10

DQ1862 Suitable Thermal Barrier

TB2066

28 mm (.79 in)

84 mm (3.3 in)

223 mm (8.7 in)

0.5 kg (1.1 lbs)

10                            8                              7

TB2031

35 mm (1.3 in)

84 mm (3.3 in)

223 mm (8.7 in)

0.65 kg (1.4 lbs)

13                            11                             10

DQ1861 Suitable  Thermal Barrier

TB2066

20 mm (.79 in)

88 mm (3.4 in)

334 mm (13.1 in)

0.65 kg (1.4 lbs)

8                               6                                6

TB2067

25 mm (.98 in)

88 mm (3.4 in)

334 mm (13.1 in)

0.65 kg (1.4 lbs)

11                              10                              8

TB2068

29 mm (1.1 in)

88 mm (3.4 in)

334 mm (13.1 in)

0.8 kg (1.8 lbs)

13                              11                            10

 

  • Reliable profiling systems for circuit assembly manufacturing
  • Powerful and user-friendly Insight™ analysis software
  • Fast and highly accurate data logger
  • High-grade stainless steel thermal barriers with small footprint
  • Intelligent battery management with built-in rapid charger
  • Live real-time analysis and review of process data with radio telemetry system

 

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